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| HCC/HCF40182B LOOK-AHEAD CARRY GENERATOR .GENERATESHI .HI .CASCADABLEFORFASTCARRI .DESI .STANDARDI .QUI .5V,10V,AND15VPARAMETRI .I .100%TESTEDFORQUI .MEETSALLREQUI DESCRIPTION GH-SPEED CARRY ACROSS FOUR ADDERS OF ADDER GROUPS GH-SPEED OPERATIONAL : tPHL = tPLH = 100ns (typ.) @ VDD = 10V ES OVER N BITS GNED FOR USE WITH HCC/HCF40181B ALU ZED, SYMMETRICAL OUTPUT CHARACTERISTICS ESCENT CURRENT SPECIFIED AT 20V FOR HCC DEVICE C RATINGS NPUT CURRENT OF 100nA AT 18V AND 25C FOR HCC DEVICE ESCENT CURRENT REMENTS OF JEDEC TENTATIVE STANDARD N 13A, "STANDARD SPECIFICATIONS FOR DESCRIPTION OF "B" SERIES CMOS DEVICES" EY (Plastic Package) F (Ceramic Frit Seal Package) M1 (Micro Package) C1 (Plastic Chip Carrier) ORDER CODES : HCC40182BFHCF4018 2BM1 PIN CONNECTIONS The HCC40182B (extended temperature range) and HCF40182B (intermediate temperature range) are monolithic integrated circuits, available in 16lead dual in-line plastic or ceramic package and plastic micro package. The HCC/HCF40182B is a high-speed look-ahead carry generator capable of anticipating a carry across four binary adders or groups of adders. The HCC/HCF40182B is cascadable to perform full look-ahead across n-bit adders. Carry, propagate-carry, and generate-carry functions are provided as enumerated in the terminal designation below. The HCC/HCF40182B, when used in conjunction with the HCC/HCF40181B arithmetic logic unit (ALU), provides full high-speed look-ahead carry capability for up to n-bit words. Each HCC/HCF40182B generates the look-ahead (anticipated carry) across a group of four ALU's. In addition, other HCC/HCF40182B's may be emplayed to anticipate the carry across sections of four look-ahead blocks up to n-bits. Carry inputs and outputs of the HCC/HCF40181B are active-high logic, and carry-generate (G) and carry-propagate (P) outputs are active low. Therefore the inputs and outputs of the HCC/HCF40182B are compatible. The HCC/HCF40182B is similar to industry type MC14582. June 1989 1/12 HCC/HCF40182B FUNCTIONAL DIAGRAM TERMINAL DESIGNATIONS TABLE Pin Name G0, G1, G2, G3 P0, P1, P2, P3 Cn C n + X, C n + Y, Cn + Z G P Pin 3, 1, 14, 5 4, 2, 15, 6 13 12, 11, 9 10 7 Active-low Carry-generate Inputs Active-low Carry-propagate Inputs Active-high Carry Input Active-high Carry Outputs Active-low Group Carry-generate Output Active-low Group Carry-propagate Output Function ABSOLUTE MAXIMUM RATINGS Symbol V DD* Vi II Pt ot Parameter Supply Voltage : HC C Types H C F Types Input Voltage DC Input Current (any one input) Total Power Dissipation (per package) Dissipation per Output Transistor for T o p = Full Package-temperature Range Operating Temperature : HCC Types H CF Types Storage Temperature Value - 0.5 to + 20 - 0.5 to + 18 - 0.5 to V DD + 0.5 10 200 100 - 55 to + 125 - 40 to + 85 - 65 to + 150 Unit V V V mA mW mW C C C Top Tstg Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability. * All voltages are with respect to VSS (GND). 2/12 HCC/HCF40182B RECOMMENDED OPERATING CONDITIONS Symbol V DD VI Top Parameter Supply Voltage : H CC Types H C F Types Input Voltage Operating Temperature : HCC Types H CF Types Value 3 to 18 3 to 15 0 to V DD - 55 to + 125 - 40 to + 85 Unit V V V C C LOGIC DIAGRAM Logic Equations : Cn + X = G0 + P0 * Cn Cn + Y = G1 + P1 * G0 + P1 * P0 * Cn 3/12 HCC/HCF40182B STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions) Test Conditions Symbol Parameter VI (V) 0/ 5 HCC Types 0/15 0/20 0/ 5 HCF 0/10 Types 0/15 V OH Output High Voltage 0/ 5 0/10 0/15 V OL Output Low Voltage 5/0 10/0 15/0 V IH Input High Voltage 0.5/4.5 1/9 1.5/13.5 V IL Input Low Voltage 4.5/0.5 9/1 13.5/1.5 I OH Output Drive Current 0/ 5 HCC Types 0/10 0/15 0/ 5 0/ 5 HCF Types 0/10 0/15 I OL Output Sink Current 0/ 5 HCC 0/10 Types 0/15 0/ 5 HCF 0/10 Types 0/15 IIH , IIL Input Leakage Current HCC Types 0/18 HCF Types 0/15 Any Input 0/ 5 2.5 4.6 9.5 13.5 2.5 4.6 9.5 13.5 0.4 0.5 1.5 0.4 0.5 1.5 <1 <1 <1 <1 <1 <1 <1 <1 <1 <1 <1 <1 0/10 VO (V) |IO| V DD (A) (V) 5 10 15 20 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 5 5 10 15 5 5 10 15 5 10 15 5 10 15 18 Any Input 15 0.3 10-5 0.3 5 7.5 1 -2 - 0.64 - 1.6 - 4.2 - 1.53 - 0.52 - 1.3 - 3.6 0.64 1.6 4.2 0.52 1.3 3.6 0.1 3.5 7 11 1.5 3 4 - 1.6 - 3.2 - 0.51 -1 - 1.3 - 2.6 - 3.4 - 6.8 - 1.36 - 3.2 - 0.44 -1 - 1.1 - 2.6 - 3.0 - 6.8 0.51 1.3 3.4 0.44 1.1 3.0 1 2.6 6.8 1 2.6 6.8 10-5 0.1 4.95 9.95 14.95 0.05 0.05 0.05 3.5 7 11 1.5 3 4 - 1.15 - 0.36 - 0.9 - 2.4 - 1.1 - 0.36 - 0.9 - 2.4 0.36 0.9 2.4 0.36 0.9 2.4 1 A mA mA T Low * Min. Max. 5 10 20 100 20 40 80 4.95 9.95 14.95 Min. Value 25C Typ. Max. 0.04 0.04 0.04 0.08 0.04 0.04 0.04 5 10 15 0.05 0.05 0.05 3.5 7 11 1.5 3 4 V V 5 10 20 100 20 40 80 4.95 9.95 14.95 0.05 0.05 0.05 V V T Hi gh * Min. Max. 150 300 600 3000 150 300 600 A Unit IL Quiescent Current CI Input Capacitance pF * TLo w = - 55C for HCC device : - 40C for HCF device. * THigh = + 125C for HCC device : + 85C for HCF device. 4/12 HCC/HCF40182B DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb = 25C, CL = 50pF, RL = 200k, typical temperature coefficient for all VDD values is 0.3%/C, all input rise and fall time = 20ns) Symbol tPHL t PLH , Parameter Propagation Delay Time P, G, in to P G Out and Carry Outs C n to Carry Outs Test Conditions V DD (V) 5 10 15 5 10 15 tT HL t T LH , Transition Time 5 10 15 Min. Value Typ. 200 100 75 240 120 90 100 50 40 Max. 400 200 150 480 240 180 200 100 80 ns ns ns Unit Output Low (sink) Current Characteristics. Output High (source) Current Characteristics. Typical Propagation Delay Time (P, G In to P, G Out and Carry-outs) vs. Load Capacitance. Typical Transition Time vs. Load Capacitance. 5/12 HCC/HCF40182B Typical Dynamic Power Dissipation vs. Input Frequency. TYPICAL APPLICATIONS 16-BIT TWO-LEVEL LOOK-AHEAD ALU 64-BIT FULL CARRY LOOK-AHEAD ALU IN 3 LEVELS 6/12 HCC/HCF40182B TYPICAL APPLICATIONS (continued) COMBINED TWO-LEVEL LOOK-AHEAD AND RIPPLE-CARRY ALU TEST CIRCUITS Quiescent Device Current. Input Voltage. Input Leakage Current. Dynamic Power Dissipation. 7/12 HCC/HCF40182B Plastic DIP16 (0.25) MECHANICAL DATA mm MIN. a1 B b b1 D E e e3 F I L Z 3.3 1.27 8.5 2.54 17.78 7.1 5.1 0.130 0.050 0.51 0.77 0.5 0.25 20 0.335 0.100 0.700 0.280 0.201 1.65 TYP. MAX. MIN. 0.020 0.030 0.020 0.010 0.787 0.065 inch TYP. MAX. DIM. P001C 8/12 HCC/HCF40182B Ceramic DIP16/1 MECHANICAL DATA mm MIN. A B D E e3 F G H L M N P Q 7.8 2.29 0.4 1.17 0.22 0.51 0.38 17.78 2.79 0.55 1.52 0.31 1.27 10.3 8.05 5.08 0.307 0.090 0.016 0.046 0.009 0.020 3.3 0.015 0.700 0.110 0.022 0.060 0.012 0.050 0.406 0.317 0.200 TYP. MAX. 20 7 0.130 MIN. inch TYP. MAX. 0.787 0.276 DIM. P053D 9/12 HCC/HCF40182B SO16 (Narrow) MECHANICAL DATA DIM. MIN. A a1 a2 b b1 C c1 D E e e3 F G L M S 3.8 4.6 0.5 9.8 5.8 1.27 8.89 4.0 5.3 1.27 0.62 8 (max.) 0.149 0.181 0.019 10 6.2 0.35 0.19 0.5 45 (typ.) 0.385 0.228 0.050 0.350 0.157 0.208 0.050 0.024 0.393 0.244 0.1 mm TYP. MAX. 1.75 0.2 1.65 0.46 0.25 0.013 0.007 0.019 0.004 MIN. inch TYP. MAX. 0.068 0.007 0.064 0.018 0.010 P013H 10/12 HCC/HCF40182B PLCC20 MECHANICAL DATA mm MIN. A B D d1 d2 E e e3 F G M M1 1.27 1.14 7.37 1.27 5.08 0.38 0.101 0.050 0.045 9.78 8.89 4.2 2.54 0.56 8.38 0.290 0.050 0.200 0.015 0.004 TYP. MAX. 10.03 9.04 4.57 MIN. 0.385 0.350 0.165 0.100 0.022 0.330 inch TYP. MAX. 0.395 0.356 0.180 DIM. P027A 11/12 HCC/HCF40182B Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use ascritical components in life support devices or systems without express written approval of SGS-THOMSON Microelectonics. (c) 1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A 12/12 |
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